- Patent Title: Copper heat dissipation material, carrier-attached copper foil, connector, terminal, laminate, shield material, printed-wiring board, metal processed member, electronic device and method for manufacturing the printed wiring board
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Application No.: US14919357Application Date: 2015-10-21
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Publication No.: US09724896B2Publication Date: 2017-08-08
- Inventor: Hajime Momoi , Satoru Morioka , Toshiyuki Ono , Hideta Arai , Ryo Fukuchi , Atsushi Miki
- Applicant: JX NIPPON MINING & METALS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: JX Nippon Mining & Metals Corporation
- Current Assignee: JX Nippon Mining & Metals Corporation
- Current Assignee Address: JP Tokyo
- Agency: Drinker Biddle & Reath LLP
- Priority: JP2014-215826 20141022
- Main IPC: H01L23/373
- IPC: H01L23/373 ; H05K1/03 ; B32B15/08 ; B32B15/20 ; B32B15/01 ; B32B37/02 ; C25D7/06 ; H05K1/09 ; H05K3/02 ; B32B7/12 ; B32B15/18 ; B32B27/18 ; B32B27/20 ; B32B27/28 ; B32B27/30 ; B32B27/32 ; B32B27/34 ; B32B27/36 ; B32B27/38 ; B32B15/04
Abstract:
A copper heat dissipation material having a satisfactory heat dissipation performance is provided. The copper heat dissipation material has an alloy layer containing at least one metal selected from Cu, Co, Ni, W, P, Zn, Cr, Fe, Sn and Mo on one or both surfaces, in which surface roughness Sz of the one or both surfaces, measured by a laser microscope using laser light of 405 nm in wavelength, is 5 μm or more.
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