Invention Grant
- Patent Title: Processing method for constraining lower melting point metals within ceramic laminates during sintering
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Application No.: US14591840Application Date: 2015-01-07
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Publication No.: US09724897B2Publication Date: 2017-08-08
- Inventor: Gangqiang Wang , Joseph Fitzpatrick , James John Steppan , Leta Yar-Li Woo , Brett Tamatea Henderson , Frank Bell
- Applicant: EmiSense Technologies, LLC
- Applicant Address: US CA Ladera Ranch
- Assignee: EmiSense Technologies, LLC
- Current Assignee: EmiSense Technologies, LLC
- Current Assignee Address: US CA Ladera Ranch
- Agency: Kunzler Law Group
- Main IPC: B32B18/00
- IPC: B32B18/00

Abstract:
A method is described. The method is a method for making a constraining ceramic assembly. The method includes applying at least one metallic electrode to a substrate. The method also includes applying a porous ceramic layer to the substrate to cover the metallic electrode. The method also includes sintering the substrate, the porous ceramic layer, and the metallic electrode together at a sintering temperature above a melting point of the metallic electrode.
Public/Granted literature
- US20160194252A1 PROCESSING METHOD FOR CONSTRAINING LOWER MELTING POINT METALS WITHIN CERAMIC LAMINATES DURING SINTERING Public/Granted day:2016-07-07
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