Processing method for constraining lower melting point metals within ceramic laminates during sintering
Abstract:
A method is described. The method is a method for making a constraining ceramic assembly. The method includes applying at least one metallic electrode to a substrate. The method also includes applying a porous ceramic layer to the substrate to cover the metallic electrode. The method also includes sintering the substrate, the porous ceramic layer, and the metallic electrode together at a sintering temperature above a melting point of the metallic electrode.
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