Invention Grant
- Patent Title: Preconditioning to enhance hydrophilic fusion bonding
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Application No.: US15016527Application Date: 2016-02-05
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Publication No.: US09725312B1Publication Date: 2017-08-08
- Inventor: Chien-Ning Hsin , I-Shi Wang , Jen-Hao Liu , Chih-Hang Chang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Eschweiler & Potashnik, LLC
- Main IPC: H01L21/76
- IPC: H01L21/76 ; B81C1/00 ; H01L21/02
Abstract:
A method for fusion bonding a pair of substrates together with silane preconditioning is provided. A surface of a first oxide layer or a surface of a second oxide layer is preconditioned with silane. The first and second oxide layers are respectively arranged on first and second semiconductor substrates. Water is applied to the surface of the first or second oxide layer. The surfaces of the first and second oxide layers are brought in direct contact. The first and second oxide layers are annealed. A method for manufacturing a microelectromechanical systems (MEMS) package using the fusion bonding is also provided.
Public/Granted literature
- US20170225948A1 PRECONDITIONING TO ENHANCE HYDROPHILIC FUSION BONDING Public/Granted day:2017-08-10
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