A HMF-based phenol formaldehyde resin is provided. The HMF-based phenol formaldehyde resin has the formula In the formula, A includes non-substituted phenol, m-cresol, p-cresol, hydroquinone or disubstituted phenol, B includes phosphate ester, phosphate, phosphine oxide, phosphinate ester or phosphinate, and n is 3-20, wherein the disubstituted phenol has substituted groups including H, halide, C1-C20 alkyl group, C1-C20 alkenyl group, C1-C20 cycloalkyl group, C1-C20 cycloalkenyl group, homocyclic aromatic group or heterocyclic aromatic group.