- Patent Title: Adduct thermosetting surfacing film and method of forming the same
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Application No.: US13288888Application Date: 2011-11-03
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Publication No.: US09725567B2Publication Date: 2017-08-08
- Inventor: Qiang Wang , Ito Akihiro , Paul Kyle , Augusto Arakaki , Catalina Gutierrez
- Applicant: Qiang Wang , Ito Akihiro , Paul Kyle , Augusto Arakaki , Catalina Gutierrez
- Applicant Address: US CA Irvine
- Assignee: Mitsubishi Chemical Carbon Fiber and Composites, Inc.
- Current Assignee: Mitsubishi Chemical Carbon Fiber and Composites, Inc.
- Current Assignee Address: US CA Irvine
- Agency: Morgan, Lewis & Bockius LLP
- Main IPC: C08J5/18
- IPC: C08J5/18 ; C08G59/38 ; C08G59/22 ; C08G59/42 ; C08L63/00 ; C08L63/04 ; C08L63/02
Abstract:
In various embodiments, the invention provides an in-situ adduct formed by reacting liquid, solid, and/or semi-solid epoxy resins with a di-carboxylic acid functionalized polymer. The adducting process at least doubles the viscosity of the mixture. A hot melt thermosetting surfacing film and composite formed using the adduct are also disclosed. Methods of preparing and using are also disclosed.
Public/Granted literature
- US20120115990A1 ADDUCT THERMOSETTING SURFACING FILM AND METHOD OF FORMING THE SAME Public/Granted day:2012-05-10
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