- Patent Title: Epoxy compound having alkoxysilyl group, method for preparing the same, composition including the same, cured product made from the composition, and use of the composition
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Application No.: US14427990Application Date: 2013-09-17
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Publication No.: US09725590B2Publication Date: 2017-08-08
- Inventor: Hyun-Aee Chun , Yun-Ju Kim , Su-Jin Park , Sang-Yong Tak , Sung-Hwan Park , Kyung-Nam Kang , Sook-Yeon Park
- Applicant: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
- Applicant Address: KR Cheonan
- Assignee: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
- Current Assignee: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
- Current Assignee Address: KR Cheonan
- Priority: KR10-2012-0102932 20120917; KR10-2013-0111473 20130917
- International Application: PCT/KR2013/008439 WO 20130917
- International Announcement: WO2014/042491 WO 20140320
- Main IPC: C07F7/08
- IPC: C07F7/08 ; C07F7/10 ; C07F7/18 ; C08L63/00 ; C09J163/00 ; C08G59/20 ; C08G59/30 ; C08K5/50 ; C08K7/14 ; C08G59/32 ; H01L33/52 ; H05K1/03

Abstract:
Provided are an alkoxysilylated epoxy compound, a composite of which exhibits good heat resistance properties, particularly low CTE and increased glass transition temperature, and a cured product thereof exhibits good flame retardancy and composition of which does not require additional silane coupling agent, a method for preparing the same and a composition and a cured product including the same. An alkoxysilylated epoxy compound including at least one alkoxysilyl group and at least two epoxy groups, a method for preparing the same by epoxide ring-opening reaction of starting material and alkoxysilylation, an epoxy composition including the epoxy compound, and a cured product and a use of the composition are provided. Since chemical bonds may be formed between alkoxysilyl group and filler and between alkoxysilyl groups, chemical bonding efficiency of the composite may be improved. Thus, the composite exhibits good heat resistance properties and the cured product exhibits good flame retardancy.
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