Invention Grant
- Patent Title: Reinforced resin composition for plating base, molded article, and electroplated component
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Application No.: US12810409Application Date: 2008-12-26
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Publication No.: US09725591B2Publication Date: 2017-08-08
- Inventor: Koichi Tezuka , Iwao Fujimoto , Masahito Nakamoto
- Applicant: Koichi Tezuka , Iwao Fujimoto , Emiko Fujimoto , Masahito Nakamoto
- Applicant Address: JP
- Assignee: UMG ABS, LTD.
- Current Assignee: UMG ABS, LTD.
- Current Assignee Address: JP
- Agency: St. Onge Steward Johnston & Reens LLC
- Priority: JP2007-338094 20071227
- International Application: PCT/JP2008/073758 WO 20081226
- International Announcement: WO2009/084640 WO 20090709
- Main IPC: C25D5/56
- IPC: C25D5/56 ; C08L25/12 ; C08L69/00 ; C08L67/02 ; C08L55/02 ; C08L51/04 ; C08L67/00 ; C08L63/00

Abstract:
The present invention relates to a reinforced resin composition for plating bases having excellent moldability, mechanical strengths, and plating ability, as well as being capable of improving the surface appearance of the molded article after plating. The reinforced resin composition for plating bases of the present invention includes: graft copolymer (A) in which a graft chain (A2) is grafted to a rubber polymer (A1) a matrix polymer (B) which includes one or more types of polymers selected from the group consisting of a vinyl-based copolymer (B-1), a polycarbonate resin (B-2), and a polyester resin (B-3); an inorganic filler (D); and a glycidyl ether unit-containing polymer (E). The content of the rubber polymer (A1) is from 5 to 25% by mass, relative to 100% by mass of the total amount of the component of (A) and the component of the matrix polymer (B).
Public/Granted literature
- US20100276289A1 Reinforced Resin Composition For Plating Base, Molded Article, And Electroplated Component Public/Granted day:2010-11-04
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