Invention Grant
- Patent Title: Low toxicity solvent system for polyamideimide and polyamide amic acid resin coating
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Application No.: US14687771Application Date: 2015-04-15
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Publication No.: US09725617B2Publication Date: 2017-08-08
- Inventor: Carissa M. Kelly , David E. Noga , John E. Sidenstick , Limor Ben-Asher , Atsuo Kondo
- Applicant: FUJIFILM Hunt Chemicals U.S.A., Inc.
- Applicant Address: US NJ Delaware
- Assignee: FUJIFILM Hunt Chemicals U.S.A., Inc.
- Current Assignee: FUJIFILM Hunt Chemicals U.S.A., Inc.
- Current Assignee Address: US NJ Delaware
- Agency: Blakely, Sokoloff, Taylor & Zafman
- Main IPC: C08G73/14
- IPC: C08G73/14 ; C09D179/08 ; C09D7/00 ; C08G73/10 ; C08G18/76 ; C08G18/34

Abstract:
A polyamideimide and polyamide amic acid resin polymer that allows for reduced levels of toxicity in manufacturing. In an embodiment, a coating composition comprises at least one polyamideimide resin, at least one aprotic dialkylamide solvent and at least one co-solvent. In another embodiment, the at least one co-solvent is selected from a group consisting of methyl acetate, n-propyl acetate, t-butyl acetate, iso-butyl acetate, ethyl acetate, isopropyl acetate, methyl lactate, ethyl lactate, n-propyl lactate, isopropyl lactate, n-butyl lactate, isobutyl lactate, t-butyl lactate, cyclohexanone, cyclopentanone, n-butyl acetate, methyl alcohol, ethyl alcohol, isopropyl alcohol, n-acetyl morpholine, ε-caprolactone and methylcyclohexane.
Public/Granted literature
- US20150299513A1 LOW TOXICITY SOLVENT SYSTEM FOR POLYAMIDEIMIDE AND POLYAMIDE AMIC ACID RESIN COATING Public/Granted day:2015-10-22
Information query
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