- Patent Title: Chemical mechanical planarization slurry composition comprising composite particles, process for removing material using said composition, CMP polishing pad and process for preparing said composition
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Application No.: US14787989Application Date: 2014-04-30
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Publication No.: US09725621B2Publication Date: 2017-08-08
- Inventor: Qingling Zhang , Bennett Greenwood , Ravi Sharma , Geoffrey D. Moeser , Brian G. Prevo , Mark J. Hampden-Smith
- Applicant: Cabot Corporation
- Applicant Address: US MA Boston
- Assignee: Cabot Corporation
- Current Assignee: Cabot Corporation
- Current Assignee Address: US MA Boston
- Priority: WOPCT/US2014/031078 20140318
- International Application: PCT/US2014/036093 WO 20140430
- International Announcement: WO2014/179419 WO 20141106
- Main IPC: B44C1/22
- IPC: B44C1/22 ; C09G1/02 ; B24B37/04 ; C09K3/14
Abstract:
CMP processes, tools and slurries utilize composite particles that include core particles having organosilica particles disposed about the core particles. Using these processes, tools and slurries can enhance removal rates, reduce defectivity and increase cleanability with respect to comparable systems and substrates.
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