Invention Grant
- Patent Title: Conductive adhesive with spherical graphene and manufacturing method thereof
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Application No.: US14398978Application Date: 2014-08-14
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Publication No.: US09725625B2Publication Date: 2017-08-08
- Inventor: Yungjui Lee , Xia Zhang , Ji Li , Yahui Chen
- Applicant: Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Applicant Address: CN Shenzhen, Guangdong
- Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd
- Current Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd
- Current Assignee Address: CN Shenzhen, Guangdong
- Agent Andrew C. Cheng
- Priority: CN201410352367 20140722
- International Application: PCT/CN2014/084332 WO 20140814
- International Announcement: WO2016/011683 WO 20160128
- Main IPC: C01B31/04
- IPC: C01B31/04 ; H01B1/24 ; B82Y30/00 ; C09J163/00 ; C09J9/02 ; B01J2/00 ; B01J2/06 ; C23C16/02 ; C23C16/26 ; C23C16/44 ; C23C16/48

Abstract:
The invention provide a manufacturing method for producing conductive adhesive with spherical graphene, and the steps comprise as following: step 1: preparing monomer, initiator, a dispersing agent and solvent to manufacture a monomer compound, and use the monomer compound to produce polymer micro ball; step 2: heating pre-treatment or plasma etching pre-treatment to the said polymer micro ball; step 3: by chemical vapor deposition, the polymer micro ball after pre-treatment from step 2 to grow graphene outside surfaces or inside polymer micro ball, and then obtain the spherical graphene; step 4: producing epoxy gel system made by epoxy, hardener and accelerant with a certain ratio mixing homogeneously; step 5: dispersing the spherical graphene from step 3 into the epoxy gel system to produce pre-material of conductive adhesive of spherical graphene; Step 6: deforming the pre-material of conductive adhesive of spherical graphene, and then obtain conductive adhesive of spherical graphene.
Public/Granted literature
- US20160280968A1 Conductive Adhesive with Spherical Graphene and Manufacturing Method thereof Public/Granted day:2016-09-29
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