Invention Grant
- Patent Title: Base polymer for hot-melt adhesive agent, and hot-melt adhesive agent
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Application No.: US14894152Application Date: 2014-05-27
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Publication No.: US09725626B2Publication Date: 2017-08-08
- Inventor: Kazuhiro Hashima , Tomoaki Takebe , Yutaka Minami , Masao Inoue , Kenji Kobayashi
- Applicant: IDEMITSU KOSAN CO., LTD.
- Applicant Address: JP Chiyoda-ku
- Assignee: IDEMITSU KOSAN CO., LTD.
- Current Assignee: IDEMITSU KOSAN CO., LTD.
- Current Assignee Address: JP Chiyoda-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2013-111323 20130527
- International Application: PCT/JP2014/064019 WO 20140527
- International Announcement: WO2014/192767 WO 20141204
- Main IPC: C08F110/06
- IPC: C08F110/06 ; C09J123/12 ; C09J5/06 ; C09J201/00 ; A61L15/24 ; A61L15/58 ; C09J5/00 ; C08F4/659
Abstract:
Provided is a hot-melt adhesive which satisfies both solidification rate and adhesiveness. A base polymer for a hot-melt adhesive which satisfies the following (1) and (2): (1) a modulus of elasticity in tension at 23° C. is 400 MPa or less; and (2) a semi-crystallization time at 23° C. is 20 minutes or less.
Public/Granted literature
- US20160115360A1 BASE POLYMER FOR HOT-MELT ADHESIVE AGENT, AND HOT-MELT ADHESIVE AGENT Public/Granted day:2016-04-28
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