Invention Grant
- Patent Title: Composite board
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Application No.: US14613439Application Date: 2015-02-04
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Publication No.: US09725901B2Publication Date: 2017-08-08
- Inventor: Eddie Wai Ho Chu , Wesley Jin Bong Lai
- Applicant: Chu & Son Inc.
- Applicant Address: US NY New York
- Assignee: Chu & Son Inc.
- Current Assignee: Chu & Son Inc.
- Current Assignee Address: US NY New York
- Agency: Kaplan Breyer Schwarz, LLP
- Agent Janine D. Geraigery, Esq.
- Main IPC: B32B38/04
- IPC: B32B38/04 ; B32B37/02 ; E04C2/00 ; E04C2/26 ; B32B7/12 ; B32B13/02 ; B32B13/10 ; B32B13/12 ; B32B37/00

Abstract:
A composite board is formed from binding a cover layer to a base layer, wherein the base layer has a composition comprising one or more of the following ingredients: magnesium oxide, recycled magnesium oxide, fibrous chips, wood chips, bamboo chips, chemical additive and water. A method of manufacturing the composite board includes providing the base layer, which includes preparing a semi-arid mixture of the above ingredients, and pouring the mixture through a funnel onto a conveyor belt. The conveyor belt passes the mixture through a series of rollers to remove excess liquid. The layer is cut into panels, which are heat before being sprayed with dried magnesium oxide. A binding agent is applied to one side of the base layer. The cover layer has a bottom surface which is then aligned and bonded to one side of the base layer.
Public/Granted literature
- US20160159032A1 COMPOSITE BOARD Public/Granted day:2016-06-09
Information query