Invention Grant
- Patent Title: Micropump
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Application No.: US14110309Application Date: 2011-11-29
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Publication No.: US09726161B2Publication Date: 2017-08-08
- Inventor: Won Kyoung Kim , Jae Chun Ryu , Kwan Hyoung Kang
- Applicant: Won Kyoung Kim , Jae Chun Ryu , Kwan Hyoung Kang , Kyoung-Ah Min
- Applicant Address: KR Pohang-si, Gyeongsangbuk-Do
- Assignee: POSTECH ACADEMY-INDUSTRY FOUNDATION
- Current Assignee: POSTECH ACADEMY-INDUSTRY FOUNDATION
- Current Assignee Address: KR Pohang-si, Gyeongsangbuk-Do
- Agency: Kile Park Reed & Houtteman PLLC
- Priority: KR10-2011-0031646 20110406
- International Application: PCT/KR2011/009165 WO 20111129
- International Announcement: WO2012/138035 WO 20121011
- Main IPC: F04B19/00
- IPC: F04B19/00 ; F04B43/04 ; H02K44/06

Abstract:
A micropump configured to control flow of an insulation fluid includes: a rectangular channel 370 configured to have a rectangular shape in which a movement passage of the insulation fluid; a planar electrode forming section 310 configured to be formed inside the rectangular channel and have a planar shape for applying an electric field; an inflow section 320 configured such that the insulation fluid flows in; and an outflow section 330 configured such that the insulation fluid flows out. Since an insulation fluid with low conductivity in a range of 10−10 to 10−12 S/m is transported with a simple technical structure without using a complicated component, it is possible to obtain the advantage of cost saving and application to various minute dynamics devices.
Public/Granted literature
- US20140219823A1 MICROPUMP Public/Granted day:2014-08-07
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