Invention Grant
- Patent Title: Sensor device and inspection method thereof
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Application No.: US15058875Application Date: 2016-03-02
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Publication No.: US09726714B2Publication Date: 2017-08-08
- Inventor: Tomoki Hikichi
- Applicant: SII Semiconductor Corporation
- Applicant Address: JP Chiba
- Assignee: SII SEMICONDUCTOR CORPORATION
- Current Assignee: SII SEMICONDUCTOR CORPORATION
- Current Assignee Address: JP Chiba
- Agency: Brinks Gilson & Lione
- Priority: JP2015-044972 20150306
- Main IPC: G01R31/10
- IPC: G01R31/10 ; G01R31/28

Abstract:
To provide a sensor device which is capable of high temperature detection using self-heat generation without providing a dedicated terminal and suppresses an increase in cost with an increase in chip occupation area due to the addition of a test pad. A sensor device is configured to include an active logic switching circuit for switching an active logic of an output driver and perform a heating inspection while switching the active logic of the output driver during an inspection process with the output driver as a heat generation source.
Public/Granted literature
- US20160258995A1 SENSOR DEVICE AND INSPECTION METHOD THEREOF Public/Granted day:2016-09-08
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