A light emitting diode assembly according to an embodiment includes a base film having first and second surfaces opposite to each other; first and second conductive layers on the first and second surfaces of the base film, respectively; a first coverlay on the first conductive layer, the first coverlay including an open portion exposing the first conductive layer; a second coverlay on the second conductive layer, the second coverlay including a heat radiation opening; and a plurality of light emitting diodes (LEDs) on the first coverlay, the plurality of LEDs contacting the first conductive layer exposed through the open portion of the first coverlay.