An optical interconnection assembly for the mutual connection of a plurality of signal switching circuit boards that may be coupled to a common planar support, backplane, includes a planar support frame, adapted to receive an ordered arrangement of connectors, which includes a series of first connectors arranged to face corresponding signal transmission ports of said boards, and a series of second connectors arranged to face corresponding signal reception ports of the boards. The support frame is adapted to guide the deployment of an interconnection circuit between corresponding pairs of first and second connectors. The interconnection circuit includes a plurality of arrangements of aggregated interconnection optical fibers extending along a longitudinal axis of the arrangement; and controlled deformation guide formations of the optical fiber arrangements, arranged to establish a plurality of non-intersecting coplanar paths of the optical fiber arrangements between corresponding pairs of first and second connectors.