In embodiments of imaging structure color conversion, an imaging structure includes a silicon backplane with a driver pad array. An embedded light source is formed on the driver pad array in an emitter material layer, and the embedded light source emits light in a first color. A conductive material layer over the embedded light source forms a p-n junction between the emitter material layer and the conductive material layer. A color conversion layer can then convert a portion of the first color to at least a second color. Further, micro lens optics can be implemented to direct the light that is emitted through the color conversion layer.