Invention Grant
- Patent Title: Member bonding apparatus
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Application No.: US14764888Application Date: 2014-01-28
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Publication No.: US09726916B2Publication Date: 2017-08-08
- Inventor: Koji Yamaguchi , Yutaka Matsumoto , Hisashi Shimizu , Tetsuya Okamoto
- Applicant: Origin Electric Company, Limited
- Applicant Address: JP Saitama
- Assignee: Origin Electric Company, Limited
- Current Assignee: Origin Electric Company, Limited
- Current Assignee Address: JP Saitama
- Agency: Squire Patton Boggs (US) LLP
- Priority: JP2013-015851 20130130; JP2013-015852 20130130; JP2013-015853 20130130
- International Application: PCT/JP2014/051769 WO 20140128
- International Announcement: WO2014/119542 WO 20140807
- Main IPC: G02F1/13
- IPC: G02F1/13 ; G02F1/1333

Abstract:
To provide a member bonding apparatus that can accurately position two members for bonding. Member alignment preprocessing device 15 adjusts to align one of the two members received by member receiving device 11 with another member in X and Y-axis directions so that the positions of bonding surfaces of the two members approximately correspond, adhesive application device 12 applies adhesive to a bonding surface of one of the two members approximately aligned, member alignment device 16 adjusts to align another member with one of the two members in X, Y, Z-axis and α, β, θ-axis directions based on images of the two members captured by a CCD camera so that positions of the bonding surfaces of the two members correspond, member bonding device 13 makes the bonding surfaces of the two members aligned be bonded to each other through the adhesive, and member delivery device 14 unloads and delivers the bonded member.
Public/Granted literature
- US20150370098A1 MEMBER BONDING APPARATUS Public/Granted day:2015-12-24
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