Resin, photoresist composition, and method for producing photoresist pattern

Invention Grant

US09726974B2 Resin, photoresist composition, and method for producing photoresist pattern 有权

Patent Title: Resin, photoresist composition, and method for producing photoresist pattern
Application No.: US14549995

Application Date: 2014-11-21
Publication No.: US09726974B2

Publication Date: 2017-08-08
Inventor: Mitsuyoshi Ochiai , Koji Ichikawa , Masafumi Yoshida
Applicant: SUMITOMO CHEMICAL COMPANY, LIMITED
Applicant Address: JP Tokyo
Assignee: SUMITOMO CHEMICAL COMPANY, LIMITED
Current Assignee: SUMITOMO CHEMICAL COMPANY, LIMITED
Current Assignee Address: JP Tokyo
Agency: Birch, Stewart, Kolasch & Birch, LLP
Priority: JP2013-243592 20131126
Main IPC: G03F7/004
IPC: G03F7/004 ; C08F220/36 ; G03F7/039 ; G03F7/38

Abstract:

A resin comprising: a structural unit represented by formula (I), and a structural unit having an acid-labile group.

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Espacenet

IPC分类:

G	物理
G03	摄影术；电影术；利用了光波以外其他波的类似技术；电记录术；全息摄影术
G03F	图纹面的照相制版工艺，例如，印刷工艺、半导体器件的加工工艺；其所用材料；其所用原版；其所用专用设备（照相排版装置入B41B；为摄影用的感光材料或处理入G03C；电记录、感光层或处理入G03G）
G03F7/00	图纹面，例如，印刷表面的照相制版如光刻工艺；图纹面照相制版用的材料，如：含光致抗蚀剂的材料；图纹面照相制版的专用设备（用于特殊工艺的光致抗蚀剂结构见相关的位置，例如，B44C，H01L，例如，H01L21/00，H05K）
G03F7/004	.感光材料（G03F7/12，G03F7/14优先）