In a lead-out wiring area, a protective conductive film is formed on a bottom surface and a side surface of a first contact hole including a surface of a first low resistance conductive film, and a part of a surface of an upper interlayer insulating film, and a second protective conductive film is formed on a bottom surface and a side surface of a second contact hole including a surface of a second low resistance conductive film, and a part of the surface of the upper interlayer insulating film. Then, a lower layer terminal part for a lower layer wiring line is formed of a laminated structure of the first low resistance conductive film and the first protective conductive film, and an upper layer terminal part for an upper layer wiring line is formed of a laminated structure of the second low resistance conductive film and the second protective conductive film.