Invention Grant
- Patent Title: Wiring substrate
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Application No.: US14992429Application Date: 2016-01-11
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Publication No.: US09727196B2Publication Date: 2017-08-08
- Inventor: Nobuyuki Tada , Yasushi Endo , Akihiro Hashimoto , Tadashi Kuriki
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- Priority: JP2013-146601 20130712
- Main IPC: H01R9/00
- IPC: H01R9/00 ; G06F3/044 ; G06F3/041 ; H05K1/02 ; H05K1/11 ; H05K1/03 ; H05K1/09 ; H05K7/00 ; H05K1/18 ; H05K1/00 ; G06F3/045 ; G02F1/1345 ; G02F1/1362

Abstract:
A wiring board includes a plurality of first terminal parts for electrically connecting with a control circuit and disposed corresponding to a plurality of first electrode parts, and first terminal wiring parts for electrically connecting the plurality of first electrode parts and the corresponding first terminal parts. Each of the first terminal wiring parts has, in at least a portion thereof falling in a circle with a radius of 10 mm centering around a boundary part between the first terminal wiring parts and the corresponding first terminal parts, a portion having a line width of 5 μm to 100 μm inclusive, the wiring resistance value of the first terminal wiring parts connected to the first terminal parts being 100 ohms to 10 kohms inclusive.
Public/Granted literature
- US20160124550A1 WIRING SUBSTRATE Public/Granted day:2016-05-05
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