Invention Grant
- Patent Title: Integrated circuit having a plurality of conductive segments
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Application No.: US14985100Application Date: 2015-12-30
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Publication No.: US09727683B2Publication Date: 2017-08-08
- Inventor: Jack Liu
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Maschoff Brennan
- Main IPC: H01L23/52
- IPC: H01L23/52 ; G06F17/50 ; H01L23/528 ; H01L23/522

Abstract:
An integrated circuit includes a cell and a first plurality of conductive segments. Each of the first plurality of conductive segments has a first predetermined width, and the first plurality of conductive segments includes a first conductive segment, and a second conductive segment. The first conductive segment and the second conductive segment are coupled to the cell to transmit a signal, and a distance between the first conductive segment and the second conductive segment is greater than the first predetermined width.
Public/Granted literature
- US20170193148A1 INTEGRATED CIRCUIT HAVING A PLURALITY OF CONDUCTIVE SEGMENTS Public/Granted day:2017-07-06
Information query
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