Invention Grant
- Patent Title: Thermally robust near-field transducer peg
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Application No.: US15163035Application Date: 2016-05-24
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Publication No.: US09728209B2Publication Date: 2017-08-08
- Inventor: Weibin Chen , Martin Blaber , Tong Zhao , Michael Christopher Kautzky , John Charles Duda
- Applicant: Seagate Technology LLC
- Applicant Address: US CA Cupertino
- Assignee: SEAGATE TECHNOLOGY LLC
- Current Assignee: SEAGATE TECHNOLOGY LLC
- Current Assignee Address: US CA Cupertino
- Agency: Hollingsworth Davis, LLC
- Main IPC: G11B11/00
- IPC: G11B11/00 ; G11B5/02 ; G11B5/31 ; G11B5/00

Abstract:
A near-field transducer includes first and second stacked base portions having a common outline shape. The second base portion is proximate alight delivery structure. A peg extends from the first base portion towards a media-facing surface. The peg includes a material that is more thermally robust than a plasmonic material of the base portion. The peg has a peg thickness that is less than a thickness of the first base portion. The first base portion has a first recess proximate the peg. The first recess separates the first base portion from the media-facing surface and exposes at least a top side of the peg.
Public/Granted literature
- US20160351209A1 THERMALLY ROBUST NEAR-FIELD TRANSDUCER PEG Public/Granted day:2016-12-01
Information query
IPC分类: