Invention Grant
- Patent Title: Transfer mechanism with multiple wafer handling capability
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Application No.: US13632229Application Date: 2012-10-01
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Publication No.: US09728436B2Publication Date: 2017-08-08
- Inventor: Farzad Tabrizi , David Barker
- Applicant: DYNAMIC MICRO SYSTEMS
- Applicant Address: DE
- Assignee: Brooks Automation, GmbH
- Current Assignee: Brooks Automation, GmbH
- Current Assignee Address: DE
- Agency: Perman & Green, LLP
- Agent Colin C. Durham
- Main IPC: H01L21/677
- IPC: H01L21/677 ; H01L21/67

Abstract:
An integrated robotic mechanism is disclosed for improving transport equipment, integrating an object movement with other functionalities such as alignment or identification. The disclosed integrated robot assembly can comprise a multiple end effector for moving a plurality of workpieces, a single end effector for moving a single workpiece, a rotation chuck incorporated on the robot body to provide alignment capability, and an optional identification subsystem for identify the object during transport. The present invention robot assembly can be used in a sorter or stocker equipment, in processing equipment, and a transfer system.
Public/Granted literature
- US20130028691A1 Transfer mechanism with multiple wafer handling capability Public/Granted day:2013-01-31
Information query
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