Invention Grant
- Patent Title: Workpiece holding apparatus
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Application No.: US15122524Application Date: 2015-02-17
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Publication No.: US09728442B2Publication Date: 2017-08-08
- Inventor: Taichi Yasuda , Tatsuo Enomoto
- Applicant: SHIN-ETSU HANDOTAI CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SHIN-ETSU HANDOTAI CO., LTD.
- Current Assignee: SHIN-ETSU HANDOTAI CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2014-056852 20140319
- International Application: PCT/JP2015/000703 WO 20150217
- International Announcement: WO2015/141122 WO 20150924
- Main IPC: B25J15/06
- IPC: B25J15/06 ; H01L21/683 ; B24B41/06 ; H01L21/304

Abstract:
A workpiece holding apparatus, including: a rigid body having a vent; a suction pad adhered onto the lower end face of rigid body and having an opening communicating with vent, being configured to suck and hold a workpiece; an air controlling mechanism communicating with the vent, being configured to aspirate or discharge air through vent to aspirate or discharge air from opening; and a swelling portion being configured to be supplied with air by air controlling mechanism through the vent to swell out at least part of an area of suction pad to be in contact with the workpiece toward the workpiece in detaching workpiece from suction pad; wherein suction pad is configured to suck and hold workpiece by bringing the opening into contact with workpiece while aspirating air by air controlling mechanism through opening, and is configured to detach the workpiece from suction pad by discharging air from opening.
Public/Granted literature
- US20170069523A1 WORKPIECE HOLDING APPARATUS Public/Granted day:2017-03-09
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