Invention Grant
- Patent Title: Substrate processing apparatus and substrate processing method
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Application No.: US14632500Application Date: 2015-02-26
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Publication No.: US09728443B2Publication Date: 2017-08-08
- Inventor: Naohiko Yoshihara , Kenji Kobayashi , Manabu Okutani
- Applicant: SCREEN Holdings Co., Ltd.
- Applicant Address: JP
- Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee Address: JP
- Agency: Ostrolenk Faber LLP
- Priority: JP2014-037293 20140227; JP2014-063694 20140326; JP2014-063695 20140326; JP2014-063696 20140326
- Main IPC: B05C13/02
- IPC: B05C13/02 ; B05C11/02 ; B05C11/00 ; H01L21/687 ; H01L21/67 ; B05C11/08
Abstract:
A substrate processing apparatus includes a substrate heating unit arranged to heat the underside of a substrate while supporting the substrate thereon and an attitude changing unit arranged to cause the substrate heating unit to undergo an attitude change between a horizontal attitude and a tilted attitude. In an organic solvent removing step to be performed following a substrate heating step of heating the substrate, the substrate heating unit undergoes an attitude change to the tilted attitude so that the upper surface of the substrate becomes tilted with respect to the horizontal surface.
Public/Granted literature
- US20150243542A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD Public/Granted day:2015-08-27
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