Invention Grant
- Patent Title: Semiconductor structure and methods
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Application No.: US15150885Application Date: 2016-05-10
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Publication No.: US09728470B1Publication Date: 2017-08-08
- Inventor: Franz Heider , Bernhard Brunner , Clemens Ostermaier
- Applicant: Infineon Technologies Austria AG
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/66 ; H01L29/20 ; H01L29/06 ; H01L29/205 ; H01L29/778 ; H01L21/02 ; H01L29/66 ; G01B11/02 ; G01B11/30

Abstract:
In an embodiment, a method for evaluating a surface of a semiconductor substrate includes directing an incident light beam having multiple wavelengths at a position of a layer having a surface profile configured to form an optical diffraction grating, the layer including a Group III nitride, detecting a reflected beam, reflected from the position, and obtaining a spectrum of reflected intensity as a function of wavelength, the spectrum being representative of the surface profile of the position of the layer from which the beam is reflected, comparing the spectrum obtained from the detected beam with one or more reference spectra stored in memory, and estimating at least one parameter of the surface profile.
Information query
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