The method of manufacturing a semiconductor device includes receiving a substrate. The substrate comprises at least one chip region and at least one scribe line next to the chip region, and each chip region comprises an active region. The method further includes disposing a buffer layer at least covering the scribe line, disposing a dielectric layer including an opening over each chip region, and disposing a bump material to the opening of the dielectric layer and electrically connecting to the active region. The method further includes forming a mold over the substrate, covering the buffer layer and cutting the substrate along the scribe line. Furthermore, the buffer layer includes an elastic modulus less than that of the mold, or the buffer layer includes a coefficient of thermal expansion less than that of the mold.