Invention Grant
- Patent Title: Systems, methods and devices for inter-substrate coupling
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Application No.: US14527534Application Date: 2014-10-29
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Publication No.: US09728489B2Publication Date: 2017-08-08
- Inventor: William David Duncan , Roderick A. Hyde , Jordin T. Kare , Thomas M. McWilliams , Thomas Allan Weaver , Lowell L. Wood, Jr.
- Applicant: Elwha LLC
- Applicant Address: US WA Bellevue
- Assignee: ELWHA LLC
- Current Assignee: ELWHA LLC
- Current Assignee Address: US WA Bellevue
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/48 ; H01F38/14

Abstract:
Inter-substrate coupling and alignment using liquid droplets can include electrical and plasmon modalities. For example, a set of droplets can be placed on a bottom substrate. A top substrate can be placed upon the droplets, which uses the droplets to align the substrates. Using the droplets in a capacitive or plasmon coupling modality, information or power can be transferred between the substrates using the droplets.
Public/Granted literature
- US20160126217A1 SYSTEMS, METHODS AND DEVICES FOR INTER-SUBSTRATE COUPLING Public/Granted day:2016-05-05
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