Provided is a package structure including a die, an encapsulant, a through via, a first dielectric layer, a conductive line structure, an adhesion promotion layer, a second dielectric layer and a connector. The encapsulant is formed aside the die. The through via is formed aside the die and penetrates through the encapsulant. The first dielectric layer is formed overlying the die, the encapsulant and the through via. The conductive line structure includes a pad over the first dielectric layer. The adhesion promotion layer overlays a first portion of a top surface and a sidewall of the pad and overlying the first dielectric layer. The second dielectric layer overlays the adhesion promotion layer. The connector is in contact with a second portion of the top surface of the pad. The second portion of the top surface of the pad is exposed by the adhesion promotion layer.