Invention Grant
- Patent Title: Electric apparatus including electric patterns for suppressing solder bridges
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Application No.: US15164502Application Date: 2016-05-25
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Publication No.: US09728516B2Publication Date: 2017-08-08
- Inventor: Hongbin Shi , Kang Joon Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Muir Patent Law PLLC
- Priority: KR10-2015-0076456 20150529
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/00

Abstract:
An electric apparatus may include a plurality of electric patterns arranged on a substrate. Each of the electric patterns may include a pad for connection with a solder ball, an electrical trace laterally extending from a portion of the pad to allow an electrical signal to be transmitted from or to the pad, a first dummy trace laterally extending from other portion of the pad, and a first connection line connecting the first dummy trace to the electrical trace. The first dummy trace may be provided at a position deviated from a straight line connecting the pad to the electrical trace.
Public/Granted literature
- US20160351517A1 ELECTRIC APPARATUS INCLUDING ELECTRIC PATTERNS FOR SUPPRESSING SOLDER BRIDGES Public/Granted day:2016-12-01
Information query
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