Invention Grant
- Patent Title: Packaging of high performance system topology for NAND memory systems
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Application No.: US13904770Application Date: 2013-05-29
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Publication No.: US09728526B2Publication Date: 2017-08-08
- Inventor: Eugene Jinglun Tam
- Applicant: SANDISK TECHNOLOGIES LLC
- Applicant Address: US TX Plano
- Assignee: SANDISK TECHNOLOGIES LLC
- Current Assignee: SANDISK TECHNOLOGIES LLC
- Current Assignee Address: US TX Plano
- Agency: Foley & Lardner LLP
- Main IPC: H01L25/18
- IPC: H01L25/18 ; G11C5/06

Abstract:
A topology for memory circuits of a non-volatile memory system reduces capacitive loading. For a given channel, a single memory chip can be connected to the controller, but is in turn connected to multiple other memory devices that fan out in a tree-like structure, which can also fan back in to a single memory device. In addition to the usual circuitry, such as a memory arrays and associated peripheral circuitry, the memory chip also includes a flip-flop circuit and can function in several modes. The modes include a pass-through mode, where the main portions of the memory circuit are inactive and commands and data are passed through to other devices in the tree structure, and an active mode, where the main portions of the memory circuit are active and can receive and supply data. Reverse active and reverse pass-through modes, where data flows in the other direction, can also be used. The pads of the memory chip can be configurable to swap input and output pads to more efficiently form the memory chips into a package.
Public/Granted literature
- US20140355325A1 Packaging of High Performance System Topology for NAND Memory Systems Public/Granted day:2014-12-04
Information query
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