Invention Grant
- Patent Title: Device, manufacturing method thereof, and electronic device
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Application No.: US15011848Application Date: 2016-02-01
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Publication No.: US09728559B2Publication Date: 2017-08-08
- Inventor: Hidekazu Miyairi , Tomoaki Moriwaka
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Fish & Richardson P.C.
- Priority: JP2015-022396 20150206; JP2015-053431 20150317
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L29/786

Abstract:
A wiring having excellent electrical characteristics is provided. A wiring having stable electrical characteristics is provided. A device is manufactured through the steps of forming a first insulating film over a substrate, forming a second insulating film over the first insulating film, removing part of the first insulating film and part of the second insulating film to form a first opening, forming a first conductor in the first opening and over a top surface of the second insulating film, and forming a second conductor by planarizing a surface of the first conductor so as to remove part of the first conductor.
Public/Granted literature
- US20160233235A1 DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE Public/Granted day:2016-08-11
Information query
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