Solid state imaging device and manufacturing method thereof
Abstract:
A solid state imaging device according to the invention includes: a semiconductor layer of a first conductivity type; a gate insulation film that is located on the semiconductor layer; a gate electrode that is located on the gate insulation film; a first impurity region of a second conductivity type that is located at least in a region outside the gate electrode on a first end portion side; a second impurity region of the second conductivity type that is located in a region extending across a second end portion that is opposite to the first end portion of the gate electrode; and a third impurity region of the first conductivity type that is located on top of the second impurity region at a position outside the gate electrode on the second end portion side, and is in contact with the second impurity region.
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