Invention Grant
- Patent Title: Solid state imaging device and manufacturing method thereof
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Application No.: US15202172Application Date: 2016-07-05
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Publication No.: US09728566B2Publication Date: 2017-08-08
- Inventor: Mitsuo Sekisawa , Kazunobu Kuwazawa , Noriyuki Nakamura , Takehiro Endo
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SEIKO EPSON CORPORATION
- Current Assignee: SEIKO EPSON CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2015-145271 20150722
- Main IPC: H01L27/146
- IPC: H01L27/146

Abstract:
A solid state imaging device according to the invention includes: a semiconductor layer of a first conductivity type; a gate insulation film that is located on the semiconductor layer; a gate electrode that is located on the gate insulation film; a first impurity region of a second conductivity type that is located at least in a region outside the gate electrode on a first end portion side; a second impurity region of the second conductivity type that is located in a region extending across a second end portion that is opposite to the first end portion of the gate electrode; and a third impurity region of the first conductivity type that is located on top of the second impurity region at a position outside the gate electrode on the second end portion side, and is in contact with the second impurity region.
Public/Granted literature
- US20170025452A1 SOLID STATE IMAGING DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2017-01-26
Information query
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