Invention Grant
- Patent Title: Metal-insulator-metal structure and method for forming the same
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Application No.: US14800144Application Date: 2015-07-15
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Publication No.: US09728597B2Publication Date: 2017-08-08
- Inventor: Hsing-Lien Lin , Chia-Shiung Tsai , Cheng-Yuan Tsai , Huey-Chi Chu , Hai-Dang Trinh , Wen-Chuan Chiang , Wei-Min Tseng
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd
- Applicant Address: TW Hsin-Chu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsin-Chu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L49/02
- IPC: H01L49/02 ; H01L21/02 ; H01L23/522

Abstract:
A semiconductor structure and a method for forming the same are provided. The method for manufacturing a semiconductor structure includes forming a bottom electrode layer over a substrate and forming a first passivation layer over the bottom electrode layer by a first atomic layer deposition process. The method for manufacturing a semiconductor structure further includes forming a dielectric layer over the first passivation layer by a second atomic layer deposition process and forming a second passivation layer over the dielectric layer by a third atomic layer deposition process. The method for manufacturing a semiconductor structure further includes forming a top electrode layer over the second passivation layer.
Public/Granted literature
- US20160163781A1 METAL-INSULATOR-METAL STRUCTURE AND METHOD FOR FORMING THE SAME Public/Granted day:2016-06-09
Information query
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