Invention Grant
- Patent Title: High-electron-mobility transistor having a buried field plate
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Application No.: US14478287Application Date: 2014-09-05
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Publication No.: US09728630B2Publication Date: 2017-08-08
- Inventor: Gerhard Prechtl , Clemens Ostermaier , Oliver Haeberlen
- Applicant: Infineon Technologies Austria AG
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L29/778
- IPC: H01L29/778 ; H01L21/02 ; H01L21/306 ; H01L29/06 ; H01L29/20 ; H01L29/205 ; H01L29/40 ; H01L29/66 ; H01L29/10

Abstract:
A high-electron-mobility field effect transistor is formed with a buffer region having a stepped lateral profile, the stepped lateral profile having first, second and third cross-sections of the buffer region, the first cross-section being thicker than the third cross-section and including a buried field plate, the second cross-section interposed between the first and third cross-sections and forming oblique angles with the first and third cross-sections. A barrier region is formed along the stepped lateral profile. The barrier region is separated from the buried field plate by a portion of the buffer region. The buffer region is formed from a first semiconductor material and the barrier region is formed from a second semiconductor material. The first and second semiconductor materials have different band-gaps such that an electrically conductive channel of a two-dimensional charge carrier gas arises at an interface between the buffer and barrier regions.
Public/Granted literature
- US20160071967A1 High-Electron-Mobility Transistor Having a Buried Field Plate Public/Granted day:2016-03-10
Information query
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