Invention Grant
- Patent Title: Semiconductor device and method of manufacturing same
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Application No.: US15058018Application Date: 2016-03-01
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Publication No.: US09728654B2Publication Date: 2017-08-08
- Inventor: Syoji Higashida
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Chen Yoshimura LLP
- Priority: JP2013-118454 20130605
- Main IPC: H01L29/872
- IPC: H01L29/872 ; H01L29/66 ; H01L29/861 ; H01L29/16 ; H01L21/265 ; H01L29/06 ; H01L29/417

Abstract:
A semiconductor device includes: a first conductive type semiconductor device; a first conductive type drift region formed by epitaxial growth on the semiconductor substrate; a plurality of first conductive type vertical implantation regions formed by multistage ion implantation in the drift region, the vertical implantation regions having a prescribed vertical implantation width and a prescribed drift region width; an anode electrode disposed on the front surface of the drift region opposite to the semiconductor substrate, the anode electrode being in Schottky contact with the drift region and in ohmic contact with the first conductive type vertical implantation regions; and a cathode electrode disposed on the rear surface of the semiconductor substrate opposite to the drift region, the cathode electrode being in ohmic contact with the semiconductor substrate.
Public/Granted literature
- US20160181442A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME Public/Granted day:2016-06-23
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