Invention Grant
- Patent Title: Light emitting device and method of manufacturing the same
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Application No.: US15281080Application Date: 2016-09-30
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Publication No.: US09728690B2Publication Date: 2017-08-08
- Inventor: Hiroaki Ukawa , Yusuke Hayashi
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-shi
- Agency: Mori & Ward, LLP
- Priority: JP2015-195194 20150930
- Main IPC: H01L33/56
- IPC: H01L33/56 ; H01L33/48 ; H01L33/60 ; H01L33/50

Abstract:
A light emitting device includes a base member including a conductive member containing silver. A light emitting element has an upper surface below an upper surface of a side wall portion. A wire electrically connects the light emitting element and the conductive member. A protective film covers the conductive member to be spaced apart from at least a part of at least one connecting portion connecting the wire and the conductive member. A first resin member continuously covers at least a portion of each of the protective film, a portion of the conductive member around the connecting portion, and the wire. The first resin member has a first gas barrier property with respect to hydrogen sulfide. A second resin member covers the light emitting element and the first resin member and has a second gas barrier property with respect to hydrogen sulfide lower than the first gas barrier property.
Public/Granted literature
- US20170092823A1 LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2017-03-30
Information query
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