Invention Grant
- Patent Title: Connector apparatus and wireless transmission system
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Application No.: US14783896Application Date: 2014-03-27
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Publication No.: US09728834B2Publication Date: 2017-08-08
- Inventor: Takahiro Takeda , Yasuhiro Okada
- Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: Sony Semiconductor Solutions Corporation
- Current Assignee: Sony Semiconductor Solutions Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Sheridan Ross P.C.
- Priority: JP2013-089002 20130422
- International Application: PCT/JP2014/058969 WO 20140327
- International Announcement: WO2014/174983 WO 20141030
- Main IPC: H04B5/00
- IPC: H04B5/00 ; H01P5/107 ; H01P5/02 ; H01Q9/28 ; H01P3/02 ; H01R12/70 ; H04B3/52
Abstract:
A connector apparatus includes a first connector unit provided at an end section of a waveguide cable and a second connector unit that is provided at a terminal section of a transmission wire formed on a print substrate and is detachable from the first connector unit, the second connector unit being structured to perform a signal transmission with the first connector unit by an electromagnetic induction.
Public/Granted literature
- US20160072174A1 CONNECTOR APPARATUS AND WIRELESS TRANSMISSION SYSTEM Public/Granted day:2016-03-10
Information query
