The present invention is directed to a liquid and solid phase power connect for packaging of an electrical device using a using a phase changing metal. The phase changing metal transitions back and forth between a liquid phase and a solid phase while constantly maintaining connection to the electrical device. The packaging uses a substrate, a restraining housing, and a lid to encase an electrical contact on the electrical device and restrain the phase changing metal. In one embodiment, the entire electrical device is encased and a voltage isolator is utilized to limit the contact areas between the phase changing metal and the electrical device. A method for relieving contact stress by transitioning the phase changing metal from a solid to a liquid is also taught.