Invention Grant
- Patent Title: Press-fit terminal and electronic component using the same
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Application No.: US14375333Application Date: 2013-01-30
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Publication No.: US09728878B2Publication Date: 2017-08-08
- Inventor: Yoshitaka Shibuya , Kazuhiko Fukamachi , Atsushi Kodama
- Applicant: JX Nippon Mining & Metals Corporation
- Applicant Address: JP Tokyo
- Assignee: JX Nippon Mining & Metals Corporation
- Current Assignee: JX Nippon Mining & Metals Corporation
- Current Assignee Address: JP Tokyo
- Agency: Drinker Biddle & Reath LLP
- Priority: JP2012-022541 20120203
- International Application: PCT/JP2013/052102 WO 20130130
- International Announcement: WO2013/115276 WO 20130808
- Main IPC: H01R13/03
- IPC: H01R13/03 ; H01R12/58 ; C23C28/02 ; C25D7/00 ; C25D5/12 ; C25D3/50 ; C25D3/54 ; C25D3/30 ; C25D3/60

Abstract:
There are provided a press-fit terminal which has an excellent whisker resistance and a low inserting force, is unlikely to cause shaving of plating when the press-fit terminal is inserted into a substrate, and has a high heat resistance, and an electronic component using the same. A press-fit terminal comprises: a female terminal connection part provided at one side of an attached part to be attached to a housing; and a substrate connection part provided at the other side and attached to a substrate by press-fitting the substrate connection part into a through-hole formed in the substrate. At least the substrate connection part has the surface structure described below, and the press-fit terminal has an excellent whisker resistance. The surface structure comprises: an A layer formed as an outermost surface layer and formed of Sn, In, or an alloy thereof; a B layer formed below the A layer and constituted of one or two or more selected from the group consisting of Ag, Au, Pt, Pd, Ru, Rh, Os, and Ir; and a C layer formed below the B layer and constituted of one or two or more selected from the group consisting of Ni, Cr, Mn, Fe, Co, and Cu. The A layer has a thickness of 0.002 to 0.2 μm. The B layer has a thickness of 0.001 to 0.3 μm. The C layer has a thickness of 0.05 μm or larger.
Public/Granted literature
- US20150011132A1 PRESS-FIT TERMINAL AND ELECTRONIC COMPONENT USING THE SAME Public/Granted day:2015-01-08
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