Invention Grant
- Patent Title: Interconnect assembly
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Application No.: US14764859Application Date: 2013-03-19
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Publication No.: US09728907B2Publication Date: 2017-08-08
- Inventor: James M. Mann , Robin Castell
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agency: HP Patent Department
- International Application: PCT/US2013/032882 WO 20130319
- International Announcement: WO2014/149033 WO 20140925
- Main IPC: H01R13/66
- IPC: H01R13/66 ; G06K7/10 ; H04W12/08 ; H04W76/02 ; H04L29/06
Abstract:
An interconnect assembly is disclosed herein. An example includes a wireless connector to wirelessly transceive data to and from a first device and a connector to transceive data to and from a second device. The interconnect assembly additionally includes an interface selector to establish a communications protocol to exchange the data between the first device and the second device.
Public/Granted literature
- US20150380876A1 INTERCONNECT ASSEMBLY Public/Granted day:2015-12-31
Information query
