Power amplifier die configurations having reduced radiated emissions
Abstract:
Apparatus and methods for orienting power amplifiers are disclosed herein. In certain implementations, a power amplifier system is provided. The power amplifier system includes a first power amplifier die that is positioned in a first position on a printed circuit board (PCB) and configured to radiate a first amount of emissions. The power amplifier system further includes a second power amplifier die that is positioned in a second orientation on the PCB and configured to radiate a second amount of emissions. The power amplifier system further includes a third power amplifier die that is positioned in a third orientation on the PCB and configured to radiate a third amount of emissions, the third power amplifier die oriented such that the first amount of emissions, the second amount of emissions, and the third amount of emissions in a first direction are less than a threshold value.
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