An electronic device including a first electronic component including a first pad unit, a second electronic component electrically connected to the first electronic component, the second electronic component including a second pad unit connected to the first pad unit, and a conductive adhesion film that couples the first pad unit to the second pad unit. The conductive adhesion film includes an adhesion resin layer, a conductive ball dispersed in the adhesion resin layer, and a curing agent capsule dispersed in the adhesion resin layer, the curing agent capsule including a curing initiator and a tube that seals the curing initiator.