Invention Grant
- Patent Title: Ceramic printed circuit board comprising an al cooling body
-
Application No.: US14008867Application Date: 2012-03-30
-
Publication No.: US09730309B2Publication Date: 2017-08-08
- Inventor: Alexander Dohn , Alfred Thimm
- Applicant: Alexander Dohn , Alfred Thimm
- Applicant Address: DE Plochingen
- Assignee: CERAMTEC GmbH
- Current Assignee: CERAMTEC GmbH
- Current Assignee Address: DE Plochingen
- Agency: Norton Rose Fulbright US LLP
- Agent James Crawford
- Priority: DE102011006726 20110404
- International Application: PCT/EP2012/055746 WO 20120330
- International Announcement: WO2012/136579 WO 20121011
- Main IPC: H05K1/02
- IPC: H05K1/02 ; F21V29/508 ; F21V29/89 ; H01L23/367 ; H01L23/373 ; H05K3/00 ; F21V29/80 ; F21V29/85 ; H01L33/64 ; H05K1/03 ; F21Y115/10
Abstract:
The invention relates to a ceramic printed circuit board comprising an upper side and a lower side, sintered metallization regions being arranged on the upper side, and the lower side being embodied as a cooling body. In order to improve the heat dissipation of components on the upper side of the printed circuit board, the lower side is also provided with sintered metallization regions to which a metal cooling body is soldered.
Public/Granted literature
- US20140016330A1 CERAMIC PRINTED CIRCUIT BOARD COMPRISING AN AL COOLING BODY Public/Granted day:2014-01-16
Information query
