Invention Grant
- Patent Title: Prepreg, laminate, metal foil-clad laminate, circuit board and LED module
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Application No.: US13882126Application Date: 2011-10-27
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Publication No.: US09730320B2Publication Date: 2017-08-08
- Inventor: Takashi Matsuda , Kiyotaka Komori , Akiyoshi Nozue , Takayuki Suzue , Mitsuyoshi Nishino , Toshiyuki Asahi , Naoyuki Tani , Yoshito Kitagawa
- Applicant: Takashi Matsuda , Kiyotaka Komori , Akiyoshi Nozue , Takayuki Suzue , Mitsuyoshi Nishino , Toshiyuki Asahi , Naoyuki Tani , Yoshito Kitagawa
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2010-244145 20101029
- International Application: PCT/JP2011/006007 WO 20111027
- International Announcement: WO2012/056703 WO 20120503
- Main IPC: H05K1/03
- IPC: H05K1/03 ; C08J5/24 ; C08K3/00 ; C08K3/22

Abstract:
A laminate with superior thermal conductivity, heat resistance, drill workability, and fire retardancy is provided. In a prepreg obtained by impregnating a woven or nonwoven fabric base with a thermosetting resin composition, the thermosetting resin composition contains 80 to 200 parts by volume of an inorganic filler per 100 parts by volume of a thermosetting resin, the inorganic filler contains (A) gibbsite type aluminum hydroxide particles having an average particle diameter (D50) of 2 to 15 μm and (B) magnesium oxide having an average particle diameter (D50) of 0.5 to 15 μm, and a compounding ratio (volume ratio) of the gibbsite type aluminum hydroxide particles (A) to the magnesium oxide (B) is 1:0.3 to 3.
Public/Granted literature
- US20130215628A1 PREPREG, LAMINATE, METAL FOIL-CLAD LAMINATE, CIRCUIT BOARD AND LED MODULE Public/Granted day:2013-08-22
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