Invention Grant
- Patent Title: Silver plating in electronics manufacture
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Application No.: US14666990Application Date: 2015-03-24
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Publication No.: US09730321B2Publication Date: 2017-08-08
- Inventor: Yung-Herng Yau , Thomas B. Richardson , Joseph A. Abys , Karl F. Wengenroth , Anthony Fiore , Chen Xu , Chonglun Fan , John Fudala
- Applicant: Enthone Inc.
- Agency: Carmody Torrance Sandak & Hennessey LLP
- Main IPC: H05K1/09
- IPC: H05K1/09 ; C23C18/40 ; H01B1/02 ; C23C22/06 ; C23C22/58 ; C23C18/44 ; C23C18/42 ; C25D3/64 ; C25D3/56 ; C25D3/46 ; C23C18/54 ; H05K3/24 ; C09D1/00 ; C23C18/16 ; H05K3/42
Abstract:
Compositions and methods for silver plating onto metal surfaces such as PWBs in electronics manufacture to produce a silver plating which is greater than 80 atomic % silver, tarnish resistant, and has good solderability.
Public/Granted literature
- US20150257264A1 SILVER PLATING IN ELECTRONICS MANUFACTURE Public/Granted day:2015-09-10
Information query
