In a leaded electronic component mounting structure in which the effect of reducing the occurrence of a blow hole is not impaired even if resin of a lead-inserted component is softened by heat during soldering and which can reduce a load placed on a lead when an external force acts, the lead of the lead-inserted component is inserted into a through hole provided in a base material of a printed wiring board, soldering is performed by immersing into molten solder, and a surface mount component and a surface mount component pad form an air vent tunnel. The air vent tunnel does not come into direct contact with the lead-inserted component, and therefore is not blocked even if the resin of the lead-inserted component softens due to soldering. Thus, the effect of reducing the occurrence of a blow hole is not impaired.