An electrical connector assembly, adapted for electrically connecting an IC package or module to a printed circuit board, includes a metallic bracket surrounding a stationary electrical connector which is mounted upon the printed circuit board. A module equipped with another electrical connector is positioned upon and removably assembled to the stationary electrical connector. A locking/ejecting member is pivotally mounted upon the bracket to releasably lock the module in position. A retention lever is pivotally mounted upon the bracket to prevent the locking/ejecting member from inadvertently or mistakenly unlatching the locking member from the module.