Invention Grant
- Patent Title: Clamp for panel-mounted electronics modules or other devices
-
Application No.: US14469379Application Date: 2014-08-26
-
Publication No.: US09730352B2Publication Date: 2017-08-08
- Inventor: Wen Peng , Lei Jiang , Chaohong Liu , Qiankun Jiang
- Applicant: Honeywell International, Inc.
- Applicant Address: US NJ Morris Plains
- Assignee: Honeywell International Inc.
- Current Assignee: Honeywell International Inc.
- Current Assignee Address: US NJ Morris Plains
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H05K7/12 ; F16B2/06 ; H02B1/044 ; H05K7/14

Abstract:
A system includes (i) a module configured to be mounted on a panel and (ii) a clamp. The clamp includes a retaining section configured to receive and retain a threaded structure. The retaining section is also configured to be connected to and apply force against the module. The clamp also includes a contact section configured to contact the panel and apply force against the panel. The clamp further includes a connecting portion connecting the retaining section and the contact section. The connecting portion is configured to allow part of the threaded structure to contact the contact section in order to create the forces applied against the panel and the module. The connecting portion can be elastic such that a separation of the retaining section and the contact section changes as the threaded structure pushes against the contact section.
Public/Granted literature
- US20160066465A1 CLAMP FOR PANEL-MOUNTED ELECTRONICS MODULES OR OTHER DEVICES Public/Granted day:2016-03-03
Information query